Neltec

Park manufactures laminates, prepregs and RF Microwave PTFE substrate materials for the global PCB, printed circuit board, electronics interconnect, advanced composites, aerospace and military markets. Nelco applications include HDI, high speed, low loss, environmentally friendly, laser drillable, polyimide, FR-4, FR4 Epoxy, BT epoxies, cyanate ester, Teflon, RF Microwave laminates and prepregs. Lead-free and Lead free assembly, RoHS compatability and CAF resistance are priorities. Nelcote applications include advance composites such as carbon, epoxy and polyester / vinyl ester materials for rocket motors, aerospace, radomes and aircraft uses. Key products include N4000-13, N4000-29, N4000-7EF, E-765, E765.

2015

Park introduces E-752-LT advanced 350 °F cure AFP material for primary and secondary Aerospace structures.
Park introduces Meteorwave 3000 and Meteorwave 4000al additions to the Meteorwave family Electronic Materials.

2012
Park introduces new line of advanced high performance electronic materials products: Mercurywave? 9350, N4800-20 & N4800-20 SI?and Meteorwave? 1000 & Meteorwave? 2000.

2011
Park completes the expansion of its Park Aerospace Technologies Corp. (“PATC”) facility in Newton, KS to design and manufacture advanced composite parts and assemblies for the aerospace market. PATC receives a Nadcap Accreditation for Non-Metallic Materials Manufacturing. Nelco Products Pte in Singapore installs additional treating capacity for PTFE materials to provide improved service to the RF and Microwave customers in the Asia Pacific region.

2010
Regular Quarterly Cash Dividend paid every quarter for the last 25 years.

2009
Park breaks ground on the expansion of its new facility in Newton, Kansas to design and manufacture advanced composite parts and assemblies for the aerospace market. Park receives R&D Supplier of the Year Award from Northrop Grumman.

2001

Park completes expansions of its Nelco? electronic material manufacturing facilities in Fullerton, CA and Newburgh, NY, which include automated lamination and finishing technology and advanced treating technology. Neltec, Inc. in Arizona adds capabilities to offer Nelco? RF/Microwave materials in the United States, including materials for long laminate antenna applications. Park sells its Nelco Technology Inc. mass lamination facility in the United States.

2000

Park offers the advanced composite material industry’s first FAA Accepted Design Allowables Database that can be shared by multiple users.

1997
Park acquires Dielektra GmbH, in Cologne, Germany, to expand its ability to provide Nelco? PCB materials in Europe.

1993
Park’s Nelco Products, PTE facility doubles its manufacturing capacity providing additional support for higher technology manufacturing.

1992
Park opened Neltec, Inc., an advanced materials manufacturing and R&D facility, in Tempe, AZ. Park acquired Metclad, later renamed to Neltec S.A., in Lannemezan, France to expand the company’s electronics product lines into the RF/Microwave markets.

1988
Park established FiberCote Industries, Inc., which was renamed Nelcote, Inc. in 2006 and Park Advanced Composite Materials, Inc. in 2008. This business unit manufactured advanced composite materials.

1986
Park constructed its Nelco Products, PTE facility in Singapore to further participate in the globalization of the electronic substrates industry into the Asia Pacific.

1984
 
Park constructed new manufacturing facilities in Fullerton, CA and Skelmersdale, England to service the company’s growing electronic materials customer base and the printed circuit board industry’s higher technology needs. Park acquired it’s Nelco SA facility in France to further service the European continent. Park pioneered the use of vacuum lamination. The Nelco Technology Inc. semi-finished multilayer facility was constructed in Tempe, AZ.

1969
Park opened its Nelco UK electronics materials subsidiary in Skelmersdale, England.
1965
Park Electrochemical Corp. opened it’s second subsidiary, Nelco Products, Inc., in Anaheim, CA.

1962
Park believes it invented the first multilayer printed circuit materials system.

1957
Park believes it founded the modern day printed circuit industry with the invention of an epoxy-glass, copper-clad laminate in Stamford, CT.

1954
Park Electrochemical Corp. was founded by Jerry Shore and Tony Chiesa who are depicted in the photograph above.